Authored by Aldgra Fredly via The Epoch Times (emphasis ours),
Taiwanese National Science and Technology Council Minister Wu Cheng-wen revealed that Taiwan and the United States have come to an agreement to prevent tariffs from affecting Taipei’s semiconductor industry.
During an interview with the Financial Times on Nov. 20, Wu stated that Taiwan is committed to assisting the United States in developing its chip industry, with the U.S. reciprocating by offering tariff relief for Taiwan’s semiconductor sector.
Wu emphasized, “Of course, there’s the recipes of how to make the chips, but it’s also about the science park management, attracting companies, integrating academic research with industry.” He highlighted that Taiwan’s approach is unique and unmatched by any other country.
While specific details of the consensus were not disclosed, Taiwanese Economic Minister Kung Ming-hsin confirmed that negotiations are ongoing to secure a trade agreement with the United States, aiming to alleviate the current 20% U.S. tariffs on Taiwanese exports.
The discussion also touched upon the potential relocation of semiconductor production to the United States, with the goal of achieving a 50-50 split in production between the two nations to meet U.S. demand.
Wu mentioned Taiwan’s strategic efforts to diversify beyond chips by establishing a “second silicon shield” in areas like drones, robotics, and medical technology. However, he stressed the importance of keeping cutting-edge research and development within Taiwan due to security concerns.
The White House has yet to comment on the recent developments, but the dialogue between Taiwan and the United States regarding semiconductor production and trade relations continues.
Frank Fang contributed to this report.
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